AMICCOM will showcase its latest low-power wireless RF chips and Wi-SUN technology at Japan's largest wireless communication exhibition, WIRELESS JAPAN x WTP, from May 29 to May 31, 2024.

AMICCOM is currently participating in Japan's largest wireless communication exhibition, WIRELESS JAPAN x WTP. At this event, we are showcasing our latest RF chips and Wi-SUN technology. These innovative technologies have garnered significant attention from the industry, attracting a large number of wireless communication professionals.

At our booth, advanced RF chips and Wi-SUN technology demonstrate their wide range of applications in smart cities, the Internet of Things (IoT), and smart homes. Many visitors have shown a keen interest in our technological implementations and future applications. They actively engaged with our technical team, discussing potential collaboration opportunities.

AMICCOM is dedicated to driving innovation and application in wireless communication technology. We are delighted to share our latest achievements with industry peers on this important platform. The atmosphere at the exhibition is vibrant, with numerous professionals from the wireless communication sector visiting our booth to explore how our technology can bring new possibilities and value to the industry.

We look forward to collaborating with more partners in the future to drive the development of wireless communication technology, achieving greater innovation and breakthroughs.


Thank you for your support and attention to AMICCOM!

Best regards,

The AMICCOM Team